MPX2102GVP PDF资料下载(12/670 页)Sensor

来自 : www.mmic.net.cn/mpx2102gvp_dat 发布时间：2021-03-25

1–6Motorola Sensor Device DataFor More Information On This Product, Go to: www.freescale.comTypical Test Conditions: Temperature per specifiedstorage maximum and minimum, no bias, test time = up to1000 hours.Potential Failure Modes: Parametric shift in offset and/orsensitivity.Potential Failure Mechanisms: Bulk die or diffusiondefects, mechanical creep in packaging components due tothermal mismatch.TEMPERATURE CYCLING (TC)This is an environmental test in which the pressure sensoris alternatively subjected to hot and cold temperatureextremes with a short stabilization time at each temperaturein an air medium. The test will stress the devices bygenerating thermal mismatches between materials.Typical Test Conditions: Temperature per specifiedstorage maximum and minimum (i.e., –40 to +125°C forautomotive applications). Dwell time ≥ 15 minutes, transfertime ≤ 5 minutes, no bias. Test time up to 1000 cycles.Potential Failure Modes: Open, parametric shift in offsetand/or sensitivity.Potential Failure Mechanisms: Wire bond fatigue, diebond fatigue, port adhesive failure, volumetric gel changesresulting in excessive package stress. Mechanical creep ofpackaging material.MECHANICAL SHOCKThis is an environmental test where the sensor device isevaluated to determine its ability to withstand a suddenchange in mechanical stress due to an abrupt change inmotion. This test simulates motion that may be seen inhandling, shipping or actual use. MIL STD 750, Method 2016Reference.Typical Test Conditions: Acceleration = 1500 g’s, orienta-tion = X, Y, Z planes, time = 0.5 milliseconds, 5 blows.Potential Failure Modes: Open, parametric shift in offsetand/or sensitivity.Potential Failure Mechanisms: Diaphragm fracture,mechanical failure of wire bonds or package.VARIABLE FREQUENCY VIBRATIONA test to examine the ability of the pressure sensor deviceto withstand deterioration due to mechanical resonance. MILSTD 750, Method 2056 Reference.Typical Test Conditions: Frequency – 10 Hz to 2 kHz, 6.0G’s max, orientation = X, Y, Z planes, 8 cycles each axis, 2hrs. per cycle.Potential Failure Modes: Open, parametric shift in offsetand/or sensitivity.Potential Failure Mechanisms: Diaphragm fracture,mechanical failure of wire bonds or package.SOLDERABILITYIn this reliability test, the lead/terminals are evaluated fortheir ability to solder after an extended time period of storage(shelf life). MIL STD 750, Method 2026 Reference.Typical Test Conditions: Steam aging = 8 hours, Flux= R,Solder = Sn63, Pb37.Potential Failure Modes: Pin holes, non–wetting,dewetting.Potential Failure Mechanisms: Poor plating, contamination.OVER PRESSUREThis test is performed to measure the ability of thepressure sensor to withstand excessive pressures that maybe encountered in the application. The test is performed fromeither the front or back side depending on the application.Typical Test Conditions: Pressure increase to failure,record value.Potential Failure Modes: Open.Potential Failure Mechanisms: Diaphragm fracture,adhesive or cohesive failure of die attach.A pressure sensor may be placed in an application whereit will be exposed to various media that may chemicallyattack the active circuitry, silicon, interconnections and/orpackaging material. The focus of media compatibility is tounderstand the chemical impact with the other environmentalfactors such as temperature and bias and determine theimpact on the device lifetime. The primary driving mecha-nism to consider is permeation which quantifies the time for achemical to permeate across a membrane or encapsulantcorrosion can result.Media related product testing is generally very specific tothe application since the factors that relate to the productlifetime are very numerous and varied. An example issolution pH where the further from neutral will drive thechemical reaction, generally to a power rule relationship. ThepH alone does not always drive the reaction either, thenon–desired products in the media such as strong acids infuels as a result of acid rain can directly influence the lifetime.It is recommended the customer and/or vendor performapplication specific testing that best represents the environ-ment. This testing should be performed utilizing in situmonitoring of the critical device parameter to insure thedevice survives while exposed to the chemical. The SensorProducts Division within Motorola has a wide range of mediaspecific test capabilities and under certain circumstances willperform application specific media testing.A sufficient sample size manufactured over a pre-definedtime interval to maximize process and time variability istested based on the guidelines of the matrix shown above.This test methodology is employed on all new productintroductions and process changes on current products.A silicon pressure sensor has a typical usage environ-ment of pressure, temperature, and voltage. Unlike thetypical bipolar transistor life tests which incorporate currentdensity and temperature to accelerate failures, a siliconpressure sensor’s acceleration of its lifetime performance isprimarily based on the pressure and temperature interac-tion with a presence of bias. This rationale was incorporatedinto the development of the Pulsed Pressure TemperatureCycling with Bias (PPTCB) test where the major accelera-tion factor is the pressure and temperature component. It isalso why PPTCB is considered the standard sensoroperational life test.FFreescale Semiconductor, Inc.n.